Calculator Server Heat Dissipation Phase Change Material PCM
TIC™812G series is low melting point thermal interface material. At 50℃, TIC™800A-AL series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.
TIC™800A-Al series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.
TIC™800A-AL Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.
TIIC800A-AL-data sheet.pdf
Applications Include:
> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs
Features:
> 0.014℃-in² /W thermal resistance
> Naturally tacky at room temperature, no adhesive required
> No heat sink preheating required
| Typical Properties of TICTM800A-AL Series |
| Product Name | TICTM805A-AL | TICTM808A-AL | TICTM810A-AL | TICTM820A-AL | Test Method |
| Color | Gray / Silve | Gray / Silver | Gray / Silver | Gray / Silver | Visual |
| Thickness | 0.005"
(0.126mm) | 0.008"
(0.203mm) | 0.010"
(0.254mm) | 0.020"
(0.508mm) | |
| Thickness Tolerance | ±0.0008''
(±0.019mm) | ±0.0008''
(±0.019mm) | ±0.0012''
(±0.030mm) | ±0.0020''
(±0.050mm) | |
| Density | 2.5g/cc | Helium Pycnometer |
| Temperature range | -25℃～125℃ | |
| Phase Change Softening Temperature | 50℃~60℃ | |
| Thermal Conductivity | 2.5 W/mK | ASTM D5470 (modified) |
| Thermal Impedance @ 50 psi(345 KPa) | 0.063℃-in²/W | 0.08℃-in²/W | 0.097℃-in²/W | 0.157℃-in²/W | ASTM D5470 (modified) |
| 0.40℃-cm²/W | 0.52℃-cm²/W | 0.63℃-cm²/W | 1.13℃-cm²/W |
Standard Thicknesses:
0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm) 0.020"(0.508mm)
Consult the factory alternate thickness.
Standard Sizes:
10" x 16"(254mm x 406mm)
TIC™800 series are supplied with a white release paper and a bottom liner.
TIC800™ series is available in kiss cut an extended pull tab liner or individual die cut shapes.
Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC™800 series products.
Reinforcement:
No reinforcement is necessary.
Packaging Details & Lead time
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials.
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract.
5.Free sample offer.
6.Quality assurance contract.
FAQ
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.
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