2.0W/MK Insulation Sheets Thermal Gap Filler Silicone Free Thermal Pad For Graphics Card Thermal Module
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Z-Paster100-20-11S Series is a high performance and compatible non-silicone material of the thermal conductive interface materials.
The roleis to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. lt applies to the liner based on silicone suitably.The flexibility and elasticity make it suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
Z-Paster100-20-11S-Series-Datasheet-REV01.pdf
Features
> Silicone-free
> ROSH compliance
> Good thermal conductive:2.0W/mK
> Soft and Compressible for low stress applications
> Available in varies thickness
Application
> Cooling components to the chassis of frame
> Car Battery & Power Supply
> Charging Pile
> Silicone-sensitive applications
> Graphics Card Thermal Module
> Set Top Box
> Medical devices
> LED Lighting
> SFP optical module
> Miniature heat tube radiator
| Typical Properties of Z-Paster100-20-11S Series |
| Color | Dark gray | Visual | Dielectric Breakdown Voltage (T= 1mm above) | >5000 VAC | ASTM D149 |
| Construction | Silicone-free The metal oxide fills | ********** | Dielectric Constant | 5.5 MHz | ASTM D150 |
| Thermal Conductivity | 2.0 W/mK | ASTM D5470 | Volume Resistivity | 6.0X1013 Ohm-meter | ASTM D257 |
| Hardness | 50 Shore 00 | ASTM 2240 | Continuous Use Temp | – 20 To 125 ℃ | ********** |
| Specific Gravity | 2.65 g/cc | ASTM D297 | Outgassing (TML) | 0.30% | ASTM E595 |
| Thickness | 0.020"-0.200"(0.25mm~5.0mm) | ASTM D374 | Flame Rating | 94 V-0 | equivalent to |
Standard size
0.010-inch to 0.200-inch (0.25mm to 5.0mm)
Options
Proprietary NS1 option available to eliminate tack from one side to aid in handling.
Packaging Details & Lead time
The packaging of Silicone free thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Our services
Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries in English of course.
Standard Export Carton Or Marked With Customer's Information Or Customized.
Provide free samples
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory solution.
Product Tags:
|
|
2.0W/MK Insulation Sheets Thermal Gap Filler Silicone Free Thermal Pad For Graphics Card Thermal Module Images
|
